? semiconductor components industries, llc, 2011 november, 2011 ? rev. 7 1 publication order number: nud4001/d nud4001, nsvd4001 high current led driver this device is designed to replace discrete solutions for driving leds in low voltage ac ? dc applications 5.0 v, 12 v or 24 v. an external resistor allows the circuit designer to set the drive current for different led arrays. this discrete integration technology eliminates individual components by combining them into a single package, which results in a significant reduction of both system cost and board space. the device is a small surface mount package (so?8). features ? supplies constant led current for varying input voltages ? external resistor allows designer to set current ? up to 500 ma ? offered in surface mount package technology (so ? 8) ? aec ? q101 qualified and ppap capable ? nsv prefix for automotive and other applications requiring unique site and control change requirements ? pb ? free package is available benefits ? maintains a constant light output during battery drain ? one device can be used for many different led products ? reduces board space and component count ? simplifies circuit and system designs typical applications ? portables: for battery back ? up applications, also simple ni ? cad battery charging ? industrial: low voltage lighting applications and small appliances ? automotive: tail lights, directional lights, back ? up light, dome light pin function description pin symbol description 1 v in positive input voltage to the device 2 boost this pin may be used to drive an external transistor as described in the app note and8198/d. 3 r ext an external resistor between r ext and v in pins sets different current levels for different application needs 4 gnd ground 5, 6, 7, 8 i out the leds are connected from these pins to ground http://onsemi.com device package shipping ? ordering information nud4001dr2 so ? 8 2500 / tape & reel so ? 8 case 751 style 25 pin configuration and schematic 1 8 r ext gnd v in i out i out i out current set point 4001 = specific device code a = assembly location y = year ww = work week = pb ? free device marking diagram boost i out ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. 1 2 3 4 8 7 6 5 nud4001dr2g so ? 8 (pb ? free) 2500 / tape & reel 4001 ayww 1 8 NSVD4001DR2G so ? 8 (pb ? free) 2500 / tape & reel
nud4001, nsvd4001 http://onsemi.com 2 maximum ratings (t a = 25 c unless otherwise noted) rating symbol value unit continuous input voltage v in 30 v non ? repetitive peak input voltage (t 1.0 ms) v p 60 v output current (for v drop 2.2 v) (note 1) i out 500 ma output voltage v out 28 v human body model (hbm) esd 1000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. v drop = v in ? 0.7 v ? v leds . thermal characteristics characteristic symbol value unit operating ambient temperature t a ? 40 to +125 c maximum junction temperature t j 150 c storage temperature t stg ? 55 to +150 c total power dissipation (note 2) derating above 25 c (figure 3) p d 1.13 9.0 w mw/ c thermal resistance, junction?to?ambient (note 2) r ja 110 c/w thermal resistance, junction?to?lead (note 2) r jl 77 c/w 2. mounted on fr ? 4 board, 2 in sq pad, 2 oz coverage. electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit output current1 (v in = 12 v, r ext = 2.0 , v leds = 10 v) i out1 305 325 345 ma output current2 (v in = 30 v, r ext = 7.0 , v leds = 24 v) i out2 95 105 115 ma bias current (v in = 12 v, r ext = open, v leds = 10 v) i bias ? 5.0 8.0 ma voltage overhead (note 3) v over 1.4 ? ? v 3. v over = v in ? v leds .
nud4001, nsvd4001 http://onsemi.com 3 typical performance curves (t a = 25 c unless otherwise noted) r ext , i out (ma) figure 1. output current (i out ) vs. external resistor (r ext ) 1 10 100 1000 1 10 1000 100 p d , power dissipation (w) t a , ambient temperature ( c) 0.000 0.200 0.400 0.600 0.800 1.000 1.200 25 35 45 55 65 75 85 95 105 115 125 0.6 ? 40 ? 10 20 50 80 110 155 t j , junction temperature ( c) figure 2. v sense vs. junction temperature v sense (v) figure 3. total power dissipation (p d ) vs. ambient temperature (t a ) 0.000 0.050 0.100 0.150 0.200 0.250 0.300 0.350 0.400 0.450 0.500 05 10 15 20 25 30 p d_control (w) v in (v) figure 4. internal circuit power dissipation vs. input voltage figure 5. current regulation vs. junction temperature 0.5 0.4 0.3 0.2 0.1 0.0 0.9 0.8 0.7 ? 25 5 35 65 95 125 140 1.2 ? 40 ? 10 20 50 80 110 155 t j , junction temperature ( c) output current, normalized 1.0 0.8 0.6 0.4 0.2 0.0 ? 25 5 35 65 95 125 140
nud4001, nsvd4001 http://onsemi.com 4 application information design guide 1. define led?s current: a. i led = 350 ma 2. calculate resistor value for r ext : a. r ext = v sense (see figure 2) / i led b. r ext = 0.7 (t j = 25 c)/ 0.350 = 2.0 3. define v in : a. per example in figure 6, v in = 12 v 4. define v led @ i led per led supplier?s data sheet: a. per example in figure 6, v led = 3.5 v + 3.5 v + 3.5 v = 10.5 v figure 6. 12 v application (series led?s array) r ext gnd v in i out current set point nud4001 boost i out 12 v i out i out 1 2 3 4 8 7 6 5 5. calculate v drop across the nud4001 device: a. v drop = v in ? v sense ? v led b. v drop = 12 v ? 0.7 v (t j = 25 c) ? 10.5 v c. v drop = 0.8 v 6. calculate power dissipation on the nud4001 device?s driver: a. p d_driver = v drop * i out b. p d_driver = 0.8 v x 0.350 a c. p d_driver = 0.280 watts 7. establish power dissipation on the nud4001 device?s control circuit per figure 4: a. p d_control = figure 4, for 12 v input voltage b. p d_control = 0.055 w 8. calculate total power dissipation on the device: a. p d_total = p d_driver + p d_control b. p d_total = 0.280 w + 0.055 w = 0.335 w 9. if p d_total > 1.13 w (or derated value per figure 3), then select the most appropriate recourse and repeat steps 1 through 8: a. reduce v in b. reconfigure led array to reduce v drop c. reduce i out by increasing r ext d. use external resistors or parallel device?s configuration (see application note and8156) 10. calculate the junction temperaure using the thermal information on page 7 and refer to figure 5 to check the output current drop due to the calculated junction temperature. if desired, compensate it by adjusting the value of r ext .
nud4001, nsvd4001 http://onsemi.com 5 typical application circuits figure 7. stop light automotive circuit using the nud4001 device to drive one high current led (550 ma). v bat 13.5 vdc + ? 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 d1 1n4004 r1 2.7 , 1/4 w r2 32 , 5.0 w r4 32 , 5.0 w r3 2.7 , 1/4 w r3 6.7 , 4.0 w led1 luxeon emitter 550 ma nud4001 nud4001 q1 q2 0 figure 8. dome light automotive circuit using the nud4001 device to drive one led (220 ma). v bat 13.5 vdc + ? 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 d1 1n4004 r1 7.0 , 1/4 w r2 7.0 , 1/4 w r3 27 , 2.0 w led1 luxeon emitter 220 ma nud4001 nud4001 q1 q2 0
nud4001, nsvd4001 http://onsemi.com 6 figure 9. nud4001 device configuration for pwm v bat 12 vdc + ? 1 2 3 4 8 7 6 5 led1 lxhl ? mw1d nud4001 q1 0 r ext1 2.0 , 1/4 w r ext2 110 k, 1/4 w led2 lxhl ? mw1d led3 lxhl ? mw1d pwm q2 2n2222 figure 10. 12 vac landscape lighting application circuit using the nud4001 device to drive three 350 ma leds. 1 2 3 4 8 7 6 5 d1 mura105t3 r2 2.0 , 1/4 w led3 luxeon emitter 350 ma nud4001 q2 0 d2 mura105t3 d3 mura105t3 d4 mura105t3 c1 220 f 12 vac from: 60 hz transformer or electronic transformer led1 luxeon emitter 350 ma led2 luxeon emitter 350 ma
nud4001, nsvd4001 http://onsemi.com 7 thermal information nud4001, nsvd4001 power dissipation the power dissipation of the so ? 8 is a function of the pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet for the so ? 8 package, p d can be calculated as follows: p d t jmax t a r ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 1.13 w. p d 150 c 25 c 110 c 1.13 w the 110 c/w for the so ? 8 package assumes the use of a fr ? 4 copper board with an area of 2 square inches with 2 oz coverage to achieve a power dissipation of 1.13 w. there are other alternatives to achieving higher dissipation from the soic package. one of them is to increase the copper area to reduce the thermal resistance. figure 11 shows how the thermal resistance changes for different copper areas. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad or an aluminum core board, the power dissipation can be even doubled using the same footprint. 60 80 100 120 140 160 180 0123456789 10 board area (in 2 ) ja ( c/w) figure 11. ja versus board area 0 50 100 150 200 250 0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 100 0 r( ) (c /w) time (sec) 1s ? 36.9 sq. mm ? 0.057 in sq. 1s ? 75.8 sq. mm ? 0.117 in sq. 1s ? 150.0 sq. mm ? 0.233 in sq. 1s ? 321.5 sq. mm ? 0.498 in sq. 1s ? 681.0 sq. mm ? 1.056 in sq. 1s ? 1255.0 sq. mm ? 1.945 in sq. figure 12. transient thermal response
nud4001, nsvd4001 http://onsemi.com 8 package dimensions soic ? 8 nb case 751 ? 07 issue ak seating plane 1 4 5 8 n j x 45 k notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 6. 751 ? 01 thru 751 ? 06 are obsolete. new standard is 751 ? 07. a b s d h c 0.10 (0.004) dim a min max min max inches 4.80 5.00 0.189 0.197 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.053 0.069 d 0.33 0.51 0.013 0.020 g 1.27 bsc 0.050 bsc h 0.10 0.25 0.004 0.010 j 0.19 0.25 0.007 0.010 k 0.40 1.27 0.016 0.050 m 0 8 0 8 n 0.25 0.50 0.010 0.020 s 5.80 6.20 0.228 0.244 ? x ? ? y ? g m y m 0.25 (0.010) ? z ? y m 0.25 (0.010) z s x s m 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 mm inches scale 6:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 25: pin 1. vin 2. n/c 3. rext 4. gnd 5. iout 6. iout 7. iout 8. iout on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nud4001/d thermal clad is a registered trademark of the bergquist company. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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